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IoT Smart Modules Simplify & Secure IoT Development

  NEW   – HL781x LPWA modules now support Non-Terrestrial Networks (NTN) for uninterrupted global connectivity.  Learn more →

Smart Modules

RC Series Modules
WP Series White Modules Legato

4G Cat-4

Module
Region (Carrier)
Bands
Fallback
Edge Processing
Details
RC7611
Americas (AT&T, T-Mobile, Verizon, Sprint, Semtech)
LTE: B2, B4, B5, B12, B13, B14, B25, B26, B66, B71
View Module
RC7620
EMEA, Australia (Semtech, Planned: Telstra)
LTE: B1, B3, B7, B8, B20, B28
2G, 3G
View Module
RC7630
Japan, Korea (NTT Docomo, KDDI, LGU+, KT, SKT (Data Only), Planned: Semtech)
LTE: B1, B3, B5, B7, B8, B18, B19, B21
View Module
WP7605
Japan (NTT Docomo (data only), Softbank (data only/LTE only), KDDI (data only), Semtech)
LTE: B1, B3, B8, B11, B18, B19, B21
3G
View Module
WP7607
EMEA (Deutsche Telekom, Semtech)
LTE: B1, B3, B7, B8, B20, B28
2G, 3G
View Module
WP7608
India, China (Planned: Semtech)
LTE: B1, B3, B5, B8, B40, B41*
2G, 3G
View Module
WP7609
Australia, Brazil, Korea (Telstra, LGU+, Semtech)
LTE: B1, B3, B5, B7, B8, B28
2G, 3G
View Module
WP7611
Americas (Verizon, AT&T, T-Mobile, Semtech, Sprint (data only))
LTE: B2, B4, B5, B12, B13, B14, B25, B26, B66, B71
3G
View Module

4G Cat-1bis

Module
Region (Carrier)
Bands
Fallback
Edge Processing
Details
RC7110
Americas (AT&T, Verizon)
LTE: B2, B4, B8, B12, B13, B66
View Module
RC7120
EMEA, APAC
LTE: B1,B3, B7, B8, B20, B28
View Module

4G Cat-1

Module
Region (Carrier)
Bands
Fallback
Edge Processing
Details
RC7611-1
Americas (AT&T, T-Mobile, Verizon, Sprint, Semtech)
LTE: B2, B4, B5, B12, B13, B14, B25, B26, B66, B71
View Module
RC7620-1
EMEA, Australia (Semtech, Planned: Telstra)
LTE: B1, B3, B7, B8, B20, B28
2G, 3G
View Module
RC7630-1
Japan, Korea (NTT Docomo, KDDI, LGU+, KT, Planned: Semtech)
LTE: B1, B3, B5, B7, B8, B18, B19, B21
View Module
WP7607-1
EMEA (Semtech)
LTE: B1, B3, B7, B8, B20, B28
2G, 3G
View Module
WP7608-1
India, China (Planned: Semtech)
LTE: B1, B3, B5, B8, B40, B41*
2G, 3G
View Module
WP7611-1
Americas (Verizon, AT&T, T-Mobile, Semtech, Sprint (data only))
LTE: B2, B4, B5, B12, B13, B14, B25, B26, B66, B71
3G
View Module

LTE-M (Cat-M1) / NB-IoT (Cat-NB1)

Module
Region (Carrier)
Bands
Fallback
Edge Processing
Details
WP7702
Global (AT&T, Semtech, T-Mobile, Verizon)
LTE: B1, B2, B3, B4, B5, B8, B12, B13, B17, B18, B19, B20, B26, B28
2G
View Module

Smart Module Key Requirements

Live-Demos icon

Simple

  • Rich set of edge and cloud API
  • Legato® application framework simplifying IoT application development
  • Optional embedded SIM with global IoT Connectivity services

Capacity icon

Scalable

  • Global Modules to deploy anywhere
  • Common Flexible Form Factor CF3® to future-proof product designs

Security icon

Secure

  • Legato® application sandbox provides a secure environment to run and control multiple applications
  • ARM TrustZone based secure credential storage and hardware accelerated cryptography API’s
  • Secure boot and secure application to ensure your device is always running verified applications

We couldn’t function without the video uplink provided by the LTE modules. Where most IoT applications only require hundreds of kilobytes, our application needs the full power of LTE to upload all the near real-time video feed to the cloud for analysis. It takes care of all the radio complexity involved in keeping a strong connection in our mobile application.

Sandeep Pandya
President, NetraDyne

netradyne Logo

With the WP module and Legato®, it has combined the processor and module functionalities in one device. Because of this, we can satisfy our customer’s needs with a single product solution in a smaller footprint.

Christian Freudenmann
Senior Product Manager, Wireless M2M Solutions, PPC

PPC Power Plus Communications Logo

Frequently Asked Questions

A module that includes the ability to run a customer software application on-board. This is usually done through an application space in the on-board cellular chipset microcontroller (MCU) and includes Flash and RAM memory.
Since no external MCU is required, smart modules reduce costs and require less board space. It also simplifies logistics and reduces inventory and product provisioning costs.

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