MC7431
4G 3G
Embedded SIM Secure Boot GNSS Cloud Connected
Air Interface: 4G LTE Cat-7 with 3G fallback
Region: Japan
Planned Carrier: KDDI,DCM,SBM

AirPrime® MC7431 LTE-Advanced Module

Optimized 4G LTE connectivity offering 150 Mbps uplink speed and unprecedented support for LTE bands in Japan

The MC7431 cellular module is part of the MC Series delivering high speed connectivity and a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation.

This LTE-A Cat-7 embedded module delivers 150 Mbps uplink speed and offers support for sXGP, making it ideal for industrial M2M and mobile computing solutions. Based on the PCI Express Mini Card standard with USB 3.0 and USB 2.0 interfaces, the MC7431 module offers an easy upgrade path to new network technologies and global access to high speed networks.

Benefits
sXGP

sXGP

Certified by JPF/JPA for the sXGP private network to provide enhanced data security and improved network performance

eUICC

eUICC

Embedded SIM to simplify and add flexibility to IoT deployments

Location Services

Location Services

GNSS receiver enables tracking and location-based services with dual L1 and L5 bands for increased accuracy

Enhanced Coverage

Enhanced Coverage

Dual SIM single standby (DSSS) switches between networks quickly to stay connected

FOTA Upgrades

FOTA Upgrades

FREE firmware over-the-air (FOTA) upgrades future-proof deployments and keep them secure

Secure Boot

Secure Boot

Prevent unauthorized code on the target to keep your connectivity secure

Industrial-Grade

Industrial-Grade

Tested for harsh environments and extreme temperatures

Technical Specifications

4G LTE
 
Category
Cat-7 
Frequency Bands
B1, B3, B5, B8, B18, B19, B39, B41, B42, B43 
3G
 
HSPA+
B1, B5, B6, B19 
Data Speed
 
Peak Download Rate
300Mbps 
Peak Upload Rate
150Mbps 
Location Services
 
Satellite Systems
Galileo, Glonass, GPS, BeiDou 
Embedded Software
 
Firmware
Secure boot, Pre-certified firmware 
System Drivers
Windows® 8, Windows® 8.1, Windows® 10, Linux, Android RIL 
Interfaces
 
USB
USB 3.0, USB 2.0 High Speed 
SIM interface 1.8V/3V
Hardware
 
Dimensions
42x30x2.3mm 
Antenna
Diversity, MIMO, GNSS Bias 
Temperature Range
-30°C / +70°C, -40°C / +85°C 
Approvals
 
Planned Carrier
DCM, SBM, KDDI 
Regulatory
JRF/JPA 
Embedded SIM
Consumer and M2M eUICC 
Cloud Services
Free Unlimited FOTA upgrades 

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