CF3®: One size, one design, one footprint, one application, any cellular technology.

Common across current and future product generations
Flexible for mass manufacturing or build-to-order assembly
Form that is compact and fixed
Factor with a defined footprint and pin-out

Since launching the first cellular embedded module in 1997, we've learned three things that matter most to our customers:

1. Compact size enables new applications for cellular,
2. Common footprints and consistent software interfaces simplify migration between technologies, and
3. Connectorized and solder-down options help scale manufacturing.

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CF3® Size
CF3® Footprint
CF3® Socket
Size

CF3® Size

Compact size enables new applications for cellular

The CF3® design ensures a consistent XY dimension of 22 x 23mm across all modules regardless of current and future technologies requirements or features. To achieve this compact size, we were the first in the industry to use 3-D packaging allowing PCB boards to be stacked using only half the space of a typical cellular module.

Footprint

CF3® Footprint

Common footprints and consistent software interfaces simplify migration between technologies

The CF3® design ensures pin-out consistency so that modules can be swapped to support different technologies or to add new features both now and in the future. To achieve this, there are 3 types of pins:

  1. Core pins: never change and are guaranteed to be forward and backward compatible within module Series (ie. Reset will always be pin 11)
  2. Extension pins: enable additional features without impacting compatibility (ie. GNSS receiver will always use pin 38 for any CF3 module with GPS and Glonass support)
  3. Custom pins: allow for unique module-specific features (ie. MIPI Debug may be on pins 2, 8, 9, 10, 60 in some modules)
Socket Options

CF3® Socket

Connectorized and solder-down options help scale manufacturing

The CF3® design ensures a common socket is available for all modules to simplify prototyping and accommodate a build-to-order manufacturing process. The innovative snap-in socket uses the same board space as a solder-down module to facilitate mass production manufacturing in the future.

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