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CF3®: Enabling flexibility to migrate between technologies and future-proof product designs.

Common across product generations
Flexible to support any wireless technology
Form that scales between module families
Factor with defined footprints and pin-outs

Since launching the first cellular embedded module in 1997, we've learned three things that matter most to our customers:

Compact size is required for many new IoT applications
Common footprints and consistent software interfaces simplify migration between technologies

No matter what wireless technology you start with (LPWA, 4G, 3G, 2G, Wi-Fi, Bluetooth), your CF3® investment is protected, lowering your total cost of ownership and giving you more variation possibilities in future product designs.

CF3® supports various module sizes and features

The CF3® standard defines 4 rings to support form factors varying from extra-small 11.5mm x 9.5mm to large 23mm x 22mm. The different sizes enable modules to further integrate various technologies on a single design and provide flexibility for supporting any number of cellular bands and frequencies.

The smaller size options are ideal for wearables and sensor applications using Wi-Fi, Bluetooth, LTE-M and NB-IoT technologies. The larger sizes are ideal for applications using Cat-1 to Cat-4 technologies for essential connectivity with optional integrated application processing capability.

Scaling between the various CF3 sizes

Scaling between modules that provide essential connectivity

Sierra Wireless - CF3 Footprint

Ring A and Ring C provide essential connectivity and create 100% scalability between Wi-Fi/Bluetooth, LTE-M, NB-IoT, 4G, 3G, and 2G modules, resulting in minimal impact on the product design because of the simple signal routing.

Scaling between essential and smart edge processing modules

Sierra Wireless - CF3 Footprint

Ring C provides essential connectivity and creates 100% scalability between core functions of HL Series and RC/WP Series, resulting in minimal impact on the product design. The smart edge processing features on Ring D would not scale from RC/WP Series to HL Series.