Discover a groundbreaking architecture for embedded wireless communications
Next generation AirPrime® embedded modules are equipped with a powerful multicore processor, secure cloud services, and open application framework to offer an entire M2M ecosystem on a module.
Simple, Scalable, Secure
Faster, easier integration is made possible thanks to dedicated application processing, an advanced open application framework, development tools, and built-in connectivity to secure cloud services. Seamless integration with the AirVantage™ M2M Cloud reduces deployment costs and makes operations both scalable and manageable, while module footprint and software compatibility allows easy scalability from 2G to 4G.
Powerful multicore processor
Achieving the highest level of integration available on the market, next generation AirPrime modules simplify system design and lower total system costs to help embedded software developers get products to market faster.
The world’s first dedicated M2M system-on-a-chip
The 2G versions of next generation AirPrime modules are powered by the world’s first dedicated M2M system-on-a-chip. Developed in collaboration with ARM, this advanced tri-core architecture includes a 2G EDGE modem, a dedicated high-speed ARM application processor and a unique implementation of the ARM Cortex-M0 processor to enable ultra-low power operation.
3G/4G chipset from Qualcomm
Built on a Qualcomm Gobi™ 9x15 chipset, the 3G/4G LTE next generation of modules can host the most robust customer M2M applications. Powerful application cores, high speed and industrial interfaces, and GNSS (GPS/GLONASS) deliver time-to-market advantage to design feature-rich next generation M2M solutions.