WISMO Pac P5186, World’s Most Compact Quadband GSM/GPRS Platform, Enriches Wavecom’s Wireless Open Workshop

Cannes, France-February 18, 2003

Wavecom SA (Nasdaq: WVCM; Euronext Nouveau Marché: 7306) today announced the launch of the WISMO Pac P5186, the world’s most compact GSM/GPRS quad band hardware platform.

Supporting an extended choice of state-of-the-art end-user features, the WISMO Pac P5186 platform enables cell phone manufacturers to tailor their offerings for particular market segments. The compact size also makes WISMO Pac P5186 suitable for mobile devices, such as laptop computers and personal digital assistants (PDA), where space is critical.

WISMO Pac P5186 enhances the choice of WISMO Platform hardware options of Wavecom’s Wireless Open Workshop (WOW!), a complete suite of software, hardware, development tools and services, organized around seven application Development Labs tailored to the needs of specific industry segments. WISMO Pac P5186 has been optimized for use within the Feature Phone and Compact Phone Development Labs as well as the Mobile Computing and PDA Development Labs.

The WISMO Pac P5186 platform supports high-resolution color displays, GPRS Class 10, MMS and a wide variety of multimedia peripherals. Interfaces and software plug-ins, including Java and Bluetooth, provide support for on-line gaming, multimedia messaging and Web downloads. The WISMO Pac P5186 platform can also be coupled with a co-processor for high-end phones offering additional features and peripherals.

Measuring just 25.4 x 32.4 x 4.75 mm, with a weight of 5.2 g, the WISMO Pac P5186 operates in the 850, 900, 1800 and 1900 MHz bands for true global roaming.

"With the WISMO Pac P5186, handset manufacturers can design the right combination of features for their targeted market segments," said Guy Lanrezac, Marketing Director of Wavecom. "Because it is so compact, the WISMO Pac P5186 also fits into sleek, thin phones targeted at style-conscious end-users."

Chinese mobile phone specialist Soutec is one of the first customers to take advantage of the possibility to develop slim phones based on WISMO Pac P5186. Mr. Chen Zhen, Vice Chairman and President at Soutec said: "The small footprint and advanced integration capabilities of the new WISMO Pac module are vital in facilitating the cutting-edge design that is needed to stay on top of mobile device development. The demand for thinner phones is a clear trend in the market, and with WISMO Pac 5186 we are creating a stylish clamshell-type phone which is less than 17 mm thick. We are very excited about the slim phone and look forward to introducing it on the market." WISMO Pac P5186 will be available in the second quarter of 2003.