AirPrime® EM Series

Ideal for mobile computing solution, AirPrime® EM embedded modules deliver high speed connectivity for integration into smaller, thinner devices in PCI Express M.2 form factors.

ModuleAir InterfaceSpecial Information
EM73xxLTEOne design for global markets. Multi-operator support.
EM8805HSPA+Address markets worldwide

Overview

Key Features
  • Available for LTE, HSPA+ networks
  • Available in PCI Express M.2 form factor
    Supports Windows® 7, Windows® 8, and Linux operating systems
Key Benefits
  • New M.2 form factor ideal for smaller, thinner devices
  • High-speed cellular connectivity with the latest technologies and multi-operator support
  • Optimized for low power consumption, enabling longer battery life 

News+Stories

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