AirPrime AR855x HSPA automotive module

The AirPrime AR855x is an automotive-grade HSPA wireless module, available in two different tri-band versions for North America (AR8550) and for Europe, Australia and Japan (AR8552). Compliant with multiple automotive manufacturing and quality processes, it is also fully compatible with the AR3550 1xRTT module and the AR5550 EV-DO Rev A module.

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Overview

Offering the highest level of compliance with automotive specifications available, the AirPrime AR Series embedded modules provide an unmatched level of quality and performance under harsh operating conditions.

Features

Unparalleled automotive-grade solution:
- ISO TS-16949 production
- PPAP, APQP processes
- Low PPM target rates
- Tolerance to 1000 thermal shock cycles
Automotive LGA form factor
(compatible with other AR Series modules)
Triband HSPA:
- AR8552: 850/900/2100MHz (Europe, Australia, Japan)
- AR8550: 850/1900/AWS band MHz (North America)
14.4 Mbps downlink, 5.76 Mbps uplink
Qualcomm MDM6200 chipset
Analog and PCM Voice
GPSOne ver 8 with 5V antenna bias and antenna protection
Optional BREW API interface
Optional Embedded SIM (SON8)

Benefits

Reduced design effort for global projects
Ultra high quality over the complete life time
Ultimate co-planarity with unique LGA layout
Simplified testing with on-board antenna diagnostic
Simplified SIM logistics and production

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Specifications

Air Interface	HSPA EDGE GPRS GSM
Frequency Bands	WCDMA 850/900/2100 MHz WCDMA 850 1900 AWS MHz EDGE/GPRS/GSM 850/900/1800/1900 MHz
Approvals	FCC, IC, CE AT&T, PTCRB, GCF Compliance with multiple automotive manufacturing and quality processes including AQPQ, PPAP, PCN, and 8D ) Planned
Standby and Idle Power	0.5-4.5mA
CPU Processor Performance	ARM1136JS
CPU Core Frequency Performance	384 MHz
CPU Analog Audio Performance	2 x analog out, 2 x analog in 1 x PCM
Codec	FR, EFR, HR, AMR
Echo Cancellation and Noise Reduction	Yes
DTMF	Yes
UART	1 x 8-Wire 1 x 2-Wire
USB	1 x USB 2.0 High Speed
I2C	1
ADC	2
RTC	1
Timers	1
Flash LED Output	1
SIM Interface	Standard SIM interface 1.8V/3V Embedded SIM (SON8) as an option SIM switch between internal and external SIM
Antenna Diversity	Yes
Location Solution	gpsOne
Embedded SIM	Yes
Control Options	AT commands BREW MP
Device Management	No
Drivers	Windows Windows CE Linux QNX
Device Dimensions	40 x 40 x 4.12 mm
Operational Temperature	-40°C to +85°C

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Support

Technical documentation for this product is available on demand only. Please contact your Sierra Wireless sales representative or technical support interface.